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詳細情報 |
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| 材料: | 炭化シリコンとグラファイト | 密度: | 2.21-2.25 g/cm3 |
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| 形: | 円筒形 | 耐熱性: | 最大1600°C |
| 応用: | エレクトロニクス用錫はんだ合金溶解 | 合金の種類: | Sn-Pb/Sn-Ag-Cu |
| 純度: | 高い | 汚染: | 最低限 |
| ハイライト: | SiC graphite crucible for soldering,tin solder alloy melting crucible,wave soldering pot graphite crucible |
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製品の説明
Tin Solder Alloy Melting SiC Graphite Crucible for Electronics
Engineered for tin-based solder alloy melting in electronics manufacturing. Ultra-clean melting surface prevents contamination that could affect solder joint reliability.
Key Features
- Compatible with Sn-Pb and lead-free solders
- Ultra-clean melting surface
- No copper or iron contamination
- Stable at solder melting temperatures
- Long service life in solder baths
Applications
Wave soldering pots, solder bar production, electronics manufacturing, PCB assembly.
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